Henkel Highlights Advanced Packaging Materials and AI-Driven Semiconductor Innovation During Global Webinar on Next-Generation AI Systems

Smart, safe and sustainable packaging innovation is becoming increasingly important within artificial intelligence infrastructure, semiconductor manufacturing and advanced computing environments. As AI systems steer toward higher compute density, faster processing and greater power consumption, semiconductor packaging materials are gaining greater importance across performance, thermal stability, reliability and manufacturing efficiency. Packaging today is becoming a core engineering layer influencing how future AI systems are built, protected and scaled.

The global adhesives, sealants and functional coatings market is currently valued between approximately $77 billion and $91 billion and is projected to surpass $123 billion by 2033, growing at a CAGR between 3.5% and 4.7%. Growth is being supported by rising demand across automotive, electronics, packaging and construction sectors alongside increasing preference for environmentally responsible and bio-based material systems. India’s adhesives market alone has crossed $2.6 billion and is projected to expand at a nearly 6.2% CAGR, supported by electronics manufacturing, industrial expansion and infrastructure growth.

Artificial intelligence is simultaneously increasing pressure on semiconductor packaging architectures, thermal-management systems, interconnect density and material reliability. High-bandwidth memory integration, chiplet architectures, 2.5D and 3D packaging systems, co-packaged optics and advanced substrate materials are becoming increasingly important as AI infrastructure expands internationally.

Within this evolving semiconductor environment, Henkel Adhesive Technologies conducted its webinar, “Powering the Next Leap in AI with Advanced Packaging,” on May 19, 2029, bringing together semiconductor packaging specialists and material experts to share future AI packaging requirements, advanced semiconductor materials and manufacturing developments influencing next-generation computing systems.

The webinar featured Venky Sundaram  (Founder & President, 3D System Scaling LLC) and Ram K. Trichur (Head of Market Strategy – Semiconductor Packaging, Henkel). Discussions explored heterogeneous integration, high-bandwidth memory scaling, thermal-density management, glass interposers, panel-level packaging, hybrid bonding and co-packaged optics within future AI infrastructure.

Venky Sundaram, who holds a B.S. from the Indian Institute of Technology Bombay and a Ph.D. from the Georgia Institute of Technology, explained how AI workloads are rapidly increasing packaging complexity across semiconductor systems. Drawing from over 25 years of semiconductor industry experience spanning AI, high-performance computing, automotive electronics, 5G communication systems and advanced battery materials, Sundaram explained how future AI packaging systems will increasingly depend on advanced integration methods capable of supporting massive data movement, power delivery and thermal efficiency.

Ram K. Trichur noted how semiconductor materials are becoming increasingly important within AI packaging ecosystems as architectures evolve around thinner dies, tighter interconnects and multi-die package environments. He further described how advanced underfills, encapsulation systems and lid-attach materials are becoming essential for package reliability, mechanical stability and manufacturing scalability.

Henkel presented its semiconductor packaging portfolio under the theme “The Foundation of Innovation: Enabling Formulations for Next Generation Advanced Packaging Technology.” The presentation covered solutions developed for flip-chip packaging, package-on-package systems, fan-in and fan-out wafer-level packaging and advanced 2.5D/3D semiconductor architectures.

The webinar also covered Henkel’s advanced underfill portfolio including LOCTITE® ECCOBOND UF 9100AA, UF 9000AG, UF 9000AE and UF 8000AA. These materials were presented for applications involving fcCSP, fcBGA and advanced AI semiconductor packaging environments requiring high toughness, fast-flow processing and thermal reliability.

Henkel additionally presented non-conductive paste and non-conductive film systems including LOCTITE® ECCOBOND NCP 5209, LOCTITE® ECCOBOND FP 5201 and LOCTITE® ABLESTIK NCF 218 developed for fine-pitch semiconductor environments, bump protection and controlled-flow packaging applications.

Wafer-level encapsulation and liquid compression molding systems formed another major focus area during the webinar. Henkel presented LOCTITE® ECCOBOND LCM 1000AG-1, developed using REACH-compliant, anhydride-free chemistry with no intentionally added PFAS. The material was presented for its warpage-reduction capability, thin-gap filling performance, void-free processing and suitability for wafer-level and panel-level packaging environments.

The webinar also covered electrically conductive adhesives supporting high-performance computing applications, including LOCTITE® ABLESTIK CE3920, ICP 3920, 8175, QMI529HT and 965-1L. These systems were presented for thermal conductivity, package flatness, grounding capability and mechanical stability across large semiconductor packages used within AI infrastructure and data-centre environments.

Sustainable material systems remained another major direction throughout the webinar. Henkel highlighted PFAS-tested materials, BPA-free formulations, environmentally responsible chemistry platforms and recyclable semiconductor packaging systems as manufacturers respond to rising environmental and regulatory requirements internationally.

Cleanroom manufacturing environments linked with semiconductor fabrication and battery production also emerged as an important focus area during the webinar. Low-particle material systems, contamination-controlled formulations and dry-cleanroom-compatible materials are becoming increasingly important as semiconductor fabrication environments expand into larger and more advanced production facilities.

Henkel also highlighted its global engineering and manufacturing presence spanning the United States, Belgium, Brazil, China, Japan, Korea, Singapore, Taiwan and the United Kingdom, alongside investments in R&D centres, customer collaboration facilities and semiconductor application support systems.

The webinar demonstrated how semiconductor packaging materials are becoming increasingly central to the future of AI infrastructure, high-performance computing and advanced electronics manufacturing. Adhesives, encapsulation systems, thermal-management materials and advanced packaging architectures are expected to occupy a far larger role as AI systems advance across higher complexity, greater bandwidth requirements and increasing energy demands.

The future of artificial intelligence will depend on how semiconductor systems are packaged, protected, cooled and manufactured with greater efficiency and environmental responsibility. Sustainable packaging materials, advanced adhesive systems and environmentally conscious semiconductor formulations are expected to become increasingly important across future electronics manufacturing and global AI infrastructure expansion.